AUSTIN, TX – Flip chip and wafer-level package sales grow more than 24% compounded from 2005 to 2010, according to a new study from TechSearch International.
 
In the report, the research firm found that performance and form factor continue to drive flip chip. Flip chip interconnect is expanding into high performance logic to a variety of devices found in wireless products. An increasing number of suppliers of ASICs, field programmable gate arrays (FPGAs), DSPs, chipsets, graphics, and microprocessors are expanding their use of flip chip in package (FCIP).  Many companies plan to use WLPs for high pin count applications (more than 100 I/Os), including analog parts with larger die sizes.
 
Gold bump demand continues to be dominated by LCD driver ICs, but an increasing number of gold stud bumped devices are also shipping.
 
The report, “Flip Chip and WLP: 2006 Market Update and Technology Developments,” provides an updated forecast for the flip chip wafer bumping market by product application, device type, FCIP/FCOB split, number of wafers, and number of die.