Wave Soldering

The dwell time, flux and temperatures are main culprits.

Fig. 1

Insufficient solder topside fillet occurs where the joint has not formed a good topside fillet. Per IPC acceptability standards, a total maximum of 25% depression, including both the primary solder destination and the secondary solder source sides, is permitted.

Fig. 2

When troubleshooting, the primary process setup areas to check include:

Fig. 3

Other things to look for in the process include:

Other things to look for with the assembly:

Other things to look for with the board design:

Paul Lotosky is global director - customer technical support at Cookson Electronics (cooksonelectronics.com; plotosky@cooksonelectronics.com.

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