WS-Series wafer inspection system performs macro-defect inspection at reported speeds of 115 wafers per hour. Has optional 3-D inspection module, enhanced camera technology, parallel processing and new wafer handling system. Using a high-speed time-delay-integration camera, performs macro defect inspection of unbumped wafers, probe marks, pre- and post-reflow solder bumps, and gold bumps.

RVSI Inspection, www.rvsi.com