The film base connector is said to provide a small space interconnection with high-density flexible circuits. Micro bump arrays built on thin film substrates reportedly reduce the thickness of the connection height by more than 70% to 300 µm thick for over 100 pins.

With printable flexible electronics, finer patterns than 30 µm line and space reportedly can be generated with smaller via holes than 80 µm diameters for double sides or multi-layer flexible circuits. The multiple screen printing processes enable embedded passive for all of LCR and active components with thin flexible substrates, including polyimide and polyethylene naphthalate films.

DKN Research, www.dknresearch.com