The S3X48 Series halide-free no-clean solder pastes from Koki Company Ltd. are said to demonstrate excellent performance across a wide range of Pb-free processing applications. Developed originally for fine-pitch BGA and CSP applications. Perform well at high reflow temperatures; rapid wetting of commonly used Pb-free alloys. Have a wide process window and six-month shelf life. Are said to eliminate “pillow” defects on BGA and CSP devices.

Christopher Associates Inc., www.christopherweb.com