The FLX2010 MKL placement machine now comes with a three-head system that performs material dispensing and consecutive placement of LEDs on film substrates. Features a placement axis with an integrated component adjustment mechanism, as well as two independent axes with a piezo flow valve and a time-pressure dispenser gear. Dispensing valves are mounted on motorized, closed-loop driven linear axes. Is said to handle substrates up to 800 x 600 mm. Substrates are vacuum-secured. Vacuum is activated with a foot-operated switch, and the film substrate sticks to the table. A time-pressure dispenser applies three dots of isolating adhesive on the substrate. Solder paste dots are applied on the substrate solder pads using a piezo-controlled PFV nozzle. LEDs are picked from standard feeders, adjusted and placed. The isolating adhesive reportedly eliminates unwanted electrical contact between the solder dots.

Essemtec AG, www.essemtec.com