Spectrum S-822 has dual-shuttle stages for chip scale package underfill and other electronics applications. Is standalone and offers controlled precision dispensing capabilities. Permits parallel processing on two shuttle stages for continuous dispensing; stages automatically slide in and out through an opening in the front of the machine. Options include choice of impingement or contact heated stations. Jet-on-the-Fly dispenses lines of dots continuously. Calibrated process jetting uses weight control. Dynamic dispense control offers flexible control parameters through closed-loop servo technology. Mass flow control uses weight-controlled dispensing and automatic calibration. Comes with Fluidmove software and ESD glass and has passed all EMC testing for CE certification.
 
Asymtek, www.asymtek.com