The X3 3-D x-ray system inspects PCBs with BGAs and other hidden solder joints. Gathers multiple oblique images to construct a rendering used in identifying solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions. Permits discrimination between top and bottom sides of boards. A typical inspection program is said to be created in fewer than 45 min. Reportedly is suited for inline or offline applications. Has remote programming and real-time SPC software.