A dummy version of Amkor's FusionQuad lead frame-based plastic package is available. Is based on the addition of exposed bottom lands within a standard VQFP package format. Is said to extend the I/O range of classic leadframe packaging to nearly 400 unique pins; delivers an approximate 50% reduction in package size for a given leadcount. Reportedly provides short signal paths to bottom lands and high power dissipation capability with the solderable exposed die attach paddle.
 
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