ME-542 thermally conductive flip chip underfill is said to offer improved thermal path for heat reduction. Was designed to achieve high reliability for in-package or chip-on-board applications and to increase thermal dissipation from the die into the substrate. Has high copper content in substrate. Has thermal conductivity of 0.8 W/mK, a reported 500% increase over standard underfill products. Is engineered to quickly flow into gaps less than 25 µm with minimal filler settling and no voiding, encapsulating interconnect arrays with a layer of protective polymer.

Lord Corp., www.lord.com