A solder analysis and identification feature has been added to the LeadTracer-RoHS XRF system. Is said to accurately identify all solder alloys within minutes. Performs a solder pot analysis, permitting users to track changes. Addresses potential weak links in production chain, including boards for second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches because of line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas, and components from placement reject trays.

RMD Instruments LLC, www.rmd-leadtracer.com