FLX2010C is for placement of special components on film or flex boards. Features a conveyor system said to permit flexible and fast placement on the substrate. Can be placed upstream in the line before a die bonder. In a downstream pick-and-place process, components reportedly are accurately placed on these dice, where the sandwich carrier will be inserted from the left side and stopped by a "stopin" mechanism. The carrier is located with a chuck. Nozzles suck in from the underside of the sandwich carrier at defined positions. The substrate can be populated from conventional component feeder systems after the alignment of the fiducials. The film leaves the placement machine via the conveyor after the release of the sandwich carrier from the vacuum.
 
Essemtec AG, www.essemtec.com