S6053BO-V fully automatic wire bond inspection system is for small wire bond analysis. The camera technology and the transport reportedly can be adapted to varying production demands. Is equipped with a universal, high-resolution VHR camera module. Can inspect down to 2 to 5 µm per pixel. Camera module can be arrayed with one or several cameras and illumination units. Bond wires smaller than 20 µm in diameter can be inspected 100%. Is available in a dual track configuration, including an integrated shuttle that loads the second track as an inspection is conducted on the first track. Is configured for fine bond wire analyses. Also said to inspect components and ASICs with high accuracy.
 
Viscom, www.viscom.com