The SC-5000 tabletop ultrasonic stencil and misprint cleaner comes with cleaning head, generator, foot pedal, large tray and 30 foam pads. 

The SAWA 5000GUS removes solder balls from stencil apertures after wipe cleaning. A handheld ultrasonic cleaning head is manually applied over apertures with any solvent. The stencil is laid on a foam pad soaked with solvent contained within a large tray. The foam is used to capture solder balls dislodged by the cleaning head. 

Seika Machinery Inc., www.seikausa.com