FusionQuad packages are lead-frame-based plastic, offering integration of ExposedPad TQFP and MLF technologies. Are said to extend I/O range of classic lead-frame packaging to nearly 400 unique pins; deliver approximately 50% reduction in package size for a given lead count. The drop test board is intended to evaluate and compare drop performance of dummy electronic components. The thermal test board helps test and optimize assembly methods that may produce significant thermal gradients across the assembly in the x, y and z axes.

Practical Components, www.practicalcompononents.com