The 03.1 Reballing/Prebumping Station reportedly is for BGAs and CSPs, and solder paste prebumping of QFN devices. Includes Rapid IR Heating to achieve Pb-free processing temperatures while preventing damage to components and boards. Is useful in converting BGAs, CSPs and QFNs from leaded to Pb-free devices, or vice versa.
 
Manncorp, www.manncorp.com/rework/multireball03/