The XD7600NT₁₀₀ digital x-ray inspection system has 0.1 µm feature recognition for finite analysis of inspection applications. Is equipped with a 2M pixel camera; offers oblique angle viewing of up to 70° in any position around any point of a 16 x 18" inspection area. Is configured with dual monitors: combines a 24" widescreen LCD monitor with the navigation map on a 20" flat panel LCD display. Is available with a tube combining 10W of power and submicron feature recognition. Can be equipped with CT providing 3-D modeling and volumetric measurement of solder joints. Is suited for analytical analysis of solder interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package.

Dage, www.dage-group.com