SE500 3-D solder paste inspection system inspects assemblies with a >70 cm²/sec. inspection speed. Can inspect pad sizes down to 01005. Has two models that accommodate different panel sizes. Features a conveyor that can transport panels from 50 x 50 mm up to 510 x 510 mm. SE500X can transport panels from 100 x 100 mm up to 810 x 610 mm. Features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability.

CyberOptics Corp., www.cyberoptics.com