Sarcon GR-H and XR-H thermal interface gap pads are said to simplify board-level maintenance by reducing material tearing during disassembly for rework and repair. Are manufactured with a hardened top surface. One-sided surface treatment is less tacky than the opposing contact side, permitting the thermal pad to consistently adhere to the electrical component or opposing heat sink. Release from component without tearing or damage. Are available in eight different formulations; offer thermal conductivity from 1.2 to 17.0W/m°K. Sarcon Hardened Surface conforms to uneven components. Gap fillers are available in sheets with thicknesses from 0.5 to 5.0 mm to 200 x 300 mm.
 
Fujipoly America Corporation, www.fujipoly.com