Siplace MultiStar now powers Siplace X-Series. Reportedly delivers a combination of chip shooting speed and extensive component range capability required for flexible end-of-line placement. Siplace MultiStar is a high-speed collect-and-place placement head capable of placing up to 24,000 cph with a component range from 01005 to 27mm². Also can place components up to 40 x 50 mm. Can automatically choose the appropriate placement mode for components; bottlenecks are said to be eliminated. Can run as a chip shooter and redeploy as an end-of-line machine without reconfiguring any heads. 

Siemens Electronics Assembly Systems, www.siplace.com