Multi-Cure 9001-E Series encapsulants are said to cure in seconds; no mixing required and viscosity is consistent. Have high ionic purity, are solvent-free, and isocyanate-free. Have a low modulus. Contain no sharp, abrasive mineral or glass fillers. Reportedly display excellent adhesion to polyimide, PET, flexible PCBs, FR-4 and ceramic boards, and provide protection for glob top and chip-on-board applications. Are for encapsulating ICs in flex circuits.
 
Dymax Corp., www.dymax.com