HTCX and HTCPX thermal management solutions are enhanced versions of HTC and HTCP. Feature improved thermal conductivity, lower oil bleed, and lower evaporation weight loss. Have been specially formulated by using a proprietary additive to provide a significant increase in thermal conductivity without sacrificing viscosity, consistency or film thicknesses. HTCPX uses various metal oxide (ceramic) powders; reportedly ensure leakage currents cannot be formed if the paste should come into contact with other parts of the assembly. Both contain no silicones and cannot migrate onto electrical contacts.

Electrolube, www.electrolube.com