Gold-Tin die attach solder paste can be reflowed in nitrogen environments with up to 200 ppm oxygen. Aurum 2 uses a special treatment to improve the wetting of eutectic 80-20 AuSn solder powder. The flux component of the solder paste remains the same; no requalification testing is needed. Is halide-free and can be applied by stencil printing or dispensing.
 
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