RP-113178 Pick-and-Place Underfilm enhances CSP and BGA solder joint reliability. Air or nitrogen reflow compatible. Requires no prebaking of boards. Is reportedly 100% reworkable and RoHS-compatible. Is said to reduce solder joint fatigue failures, and requires no additional cure cycle. Implement into design and manufacturing process by utilizing existing SMT Line and existing tape and reel feeders. Comes in standard EIA-481 carrier tape.
 
Alltemated Inc., www.alltemated.com