Condor EZ bond testing solution offers multiple test capabilities. Standard bond testing applications include wire pull, ball shear, die shear; also has capability to perform peel testing, push testing, and roller testing. All tests can be done on one test head; features four different measurement sensors. Can perform mechanical shock testing by changing the test head for impact testing or ribbon peel testing of photovoltaic cells by using USB tweezers. Joysticks move the X-Y stage to the desired position and feature 12 logically arranged buttons. Software features onboard graphics and intelligent wizards.

Xyztec, www.xyztec.com