NL930PT no-clean, Pb-free, halide-free pin probable solder paste has clear residues and is said to be consistently printable to low surface area ratios. Can be used with SN100C and SAC 305. Has good pin probability, print release to 0.55 SAR when used with Slic Stencil, and wets to all surface finishes, including OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a range of temperatures (65°-85°F) and relative humidity (25-65% RH). Stencil prints at up to 200 mm/sec.; voiding performance exceeds IPC Class III requirements. Features enhanced tack performance and printer open time, as well as shiny solder joints when used with SN100C.

FCT Assembly, www.fctassembly.com