NL932 no-clean, Pb-free, halide-free solder paste is said to feature good solderability, improves stencil life, and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index across all board designs. Provides print release down to 0.55 SAR when used with the Slic Stencil. Features excellent wetting on OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a wide range of temperatures (65°-85°F) and relative humidity (25-65% RH). Reportedly stencil prints at up to 200 mm/sec.; voiding exceeds IPC Class III.

FCT Assembly, www.fctassembly.com