The AIM print test board and kit includes new component technologies: 0.4 and 0.5 mm pitch FusionQuad components, DualRow MLF, 01005 and 0201 resistors, as well as others. Contains BGA and microBGA pads, both having circular and square pad designs to test paste release. Includes the standard IPC slump test pattern. A number on the board indicates the distances between pads. Common pad sizes are incorporated into the layout, including 1206, 0805, 0402, 01005 and 0201 rectangular pads for discrete components; have varying distances between them. Four pads are available for use with various aperture styles to permit wetting tests. Includes several fine-pitch QFP pads.

AIM, www.aimsolder.com