PR1 BGA Solder Ball Checker is for inspection of BGA soldering and QFP lead sections. Provides inspection of soldered points and BGA surfaces; features a conductive body for ESD. Enables visual inspection of QFP leads and chip parts. The handheld tool is 50 x 30 x 15 mm. Weighs 25 g. Comes with a wrist strap. Is capable of inspecting the interior section of BGA packages using a battery-powered white LED lighting system. With an expanded lens, it is capable of up to 7X magnification.

Seika Machinery Inc., www.seikausa.com