Correct-A-Chip series Fine Pitch Bump Adapters accommodate pitches down to 0.40 mm. Can use higher pitch devices on smaller pitch boards. Tops have landing pads that can be designed to accept any device on any pitch and settle into fine pitch footprints including TSSOP and QFP with pitches down to 0.40 mm. Bottom has raised connection pads up to 0.010". Integrate higher pitch BGA devices with boards laid out with smaller pitches. Apparatus can operate up to 221°F for FR4 and 266°F for Pb-free. Come in tape and reel. Standard line and trace spacing down to 0.003" can be used. Available in panelized form, adapter only, or with devices mounted.

Aries, www.arieselec.com