ProActiv printing technique includes a control subsystem and a set of squeegees featuring embedded electronics. Is said to extend the print process window for consistent printing of small apertures for 0.3 mm CSPs and 01005 passives. Enables next-generation components to be printed next to standard components using a conventional printing process with a single thickness stencil. When activated, energizes paste in contact with or in very close proximity to the squeegee blade. Reportedly does not alter the paste but makes it more compliant, improving packing density of solder particles into apertures and enhancing solder bond, increasing solder paste transfer efficiency.

DEK, www.dek.com/proactiv