Excen high-speed modular mounter has 16 nozzles and a speed of 120,000 CPH. Is for fine chip placement; monitors pre- and post-part placement. Has a side-view vision system. Includes non-stop device type change; mixed production of different boards, and a smart feeder with auto splicing and auto loading functions. Applies high rotary modular head.

Samsung Techwin SMT, http://www.samsung-smt.com