800 large format automatic optical inspection system is for printed circuit board assemblies up to 21.6" x 31.5". Offers full-color inspection. Has short programming time and combined pattern matching and condition-based AOI algorithms; has high throughput with excellent defect capture and low false calls on solder paste, components, and solder fillets. THT inspection algorithms allow for 100% inspection of through-hole component leads. Includes telecentric primary lens with the option of up to eight additional cameras for angled inspection, RGB lighting, and through lens illumination. Bench-top and inline versions are available.

MEK/Marantz, www.escapethegreyworld.com