TS9000 Series is a Piezoelectric-driven, non-contact Jet Tech valve. Handles fluid viscosities to 2 million Cps. Produces hundreds of deposits in less than one sec. Has adjustable parameter settings and a variety of nozzle shape and sizes, with different tappet configurations. Features field replaceable spare parts. Applications include jetting silver epoxies for die bonding processes, silicone phosphor in the LED assembly process, underfill in microelectronic package applications on PCBAs, and micro dots of UV adhesive in medical device applications. Is shipped standard with a valve, controller, cables and three nozzle tools.

Techcon Systems, www.techconsystems.com