Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board assembly reportedly prints well, particularly with ultra fine feature repeatability (11 mil squares) and high-throughput applications. Lumet P34 is for long soak reflow profiles. Lumet P39 Pb-free, zero-halogen, no-clean solder paste is for LED assembly and other applications that must pass JIS Copper Corrosion test. Lumet P39 has clear, colorless flux residue; is for LED package-on-board assembly. Is designed to enable consistent fine-pitch printing capability to 180µm circle printed with 100µm thickness stencil. Lumet P52 Pb-free alloy has a melting point below 140°C, and has been used with peak reflow profiles between 155° and 190°C.

Alpha, http://alpha.alent.com/Markets/LED