ViproInline AOI system for THT assemblies can be integrated into an automated production line after the wave or selective soldering process for the detection of soldering and placement faults. Features camera lighting unit designed for bottom-side inspection of through-hole assemblies. Detects soldering and placement faults such as bridges, open solder joints, poor meniscus or missing pins, solder balls and washed off neighboring SMD components. Orthogonal sensor head allows analysis with its vertical viewing direction. Images are captured with a 5mp RGB area scan camera. Multi-color LED lighting consists of centrically focused and diffused lighting from the side. Can be equipped with a 10mp camera or with several bottom-side cameras. Can be provided with an additional axis and camera unit for the detection of hole fill at the PCB topside, as well as simultaneous solder joint inspection of through-hole and glued SMD components. Can be integrated into the PowerSelective system.

Seho Systems, www.seho.de