CA-195 die attach adhesive is for attaching LED and other small semiconductor die to silver and copper lead frames. Is thermally and electrically conductive, and its glass transition temperature (Tg) facilitates wire bonding to small die. Has low extractable ionics and high adhesion to silver and copper lead frames. Has a dispense open time greater than 24 hr.; maintains optimized rheology for pin transfer or needle dispensing.

Engineered Material Systems, www.emsadhesives.com