CA-180 conductive adhesive is for die-attach applications in smart cards, circuit assembly, photonics or camera modules. Is said to cure in 30 min. at 80°C or in seconds at 200°C. Glass transition temperature (Tg) and modulus are said to be moderate. Rheology optimized for needle dispensing by time-pressure, auger or positive displacement. Develops conductivity with short, low-temperature cures. After curing for 30 minutes at 80°C, its electrical conductivity is 0.00006 ohm-cm.

Engineered Materials Systems, www.emsadhesives.com.