MDP-300 combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint. Includes synchronous head motion that enables bond head and dispenser to work in parallel. Is said to increase bond quality and enhance overall throughput. Supports up to 300mm (12”) wafer substrates. Connects to SMT machines.

Panasonic Factory Solutions Co. of America, www.panasonicfa.com