SMT 88UH reportedly can be underfilled at room temperature without preheating substrate. Advantages reportedly include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance. Can be stored in a regular refrigerator or freezer. Can be used for chip-scale packaging, ball grid array devices, package-on-package, land grid array, and certain flip-chip applications. Suitable for bare chip protection in memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials, http://yincae.com/board-level-assembly.html