MC7885-UFS flip-chip underfill has a Tg of >240°C and stress-absorbing capabilities. Underfills large-area flip-chip components and reportedly cures without voids and internal stresses. For use in chip-on-board underfill and standard flip-chip underfill component applications. Reportedly withstands temperatures up to 350°C without thermal degradation. Cured underfill has less than 20ppm/°C in coefficient of thermal expansion and higher than 6 GPa in modulus. Most curing can be done at 120°C; can increase temp. to 150°C.

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