SMT 158 series of underfill is customizable in color, filler concentration, and particle sizes. Is said to cure fast and at low temperatures. For bare chip protection in advanced packages like memory cards, chip carriers, hybrid circuits and multichip modules. Is said to eliminate cleaning. Is compatible with lead-free processes and for ultra-low bump applications such as chip-scale packages, ball grid arrays, PoP, land grid arrays, and some flip-chip applications. 

Yincae Advanced Materials,  http://www.yincae.com/technical-information.html