RMA-155 Pb-free solder paste was designed for balanced performance; is reportedly ideal for high-complexity boards with a variety of component sizes. Compatible with SnPb and SAC alloys. Is said to deliver consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation barrier. Is halogen-free, resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes (QFNs). Conforms to RMA classification for QQ-S-571F.

Indium Corp., www.indium.com