Xi3400 automated x-ray inspection system inspects solder joints and other hidden features found in electronic assemblies, printed circuit boards, and packaged semiconductors. Includes inline or offline operation. Monitors process information in real-time. Uses digital tomosynthesis technology to acquire multiple images in different slice heights in one inspection cycle. Images can discriminate between components on the top and bottom slices of double-sided boards for automated inspection.

Nordson Dage, www.nordsondage.com