OM-535 is a low-temperature solder paste designed to enable a single reflow application for assembly of double-sided printed circuit boards. Has excellent no-solder drip during reflow. With SBX02 alloy and a melting point below 140°C, it has been used with peak reflow profiles between 155°C and 190°C. Flux residue provides excellent electrical resistivity. Eliminates extra wave or selective wave soldering process when temperature-sensitive through-hole components are used. Eliminates need for managing bar solder, wave soldering flux supplies, and pallets. Allows desired obsolescence of an extra SMT process.

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