CA-180 low-temperature cure conductive adhesive is for die attach and general circuit assembly applications. Cures in 30 min. at 80°C, three min. at 100°C, or 10 sec. at 150°C with an electrical conductivity of 4 x 10^-5ohm-cm. Reportedly ideal for applications in which components are temperature-sensitive and require high conductivity interconnects. Has a 48-hr. work life and a 12,000 cP viscosity at 5 rpm. Was developed to pass reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications.

Engineered Material Systems, www.emsadhesives.com