ALD-ST3-450 5D solder paste inspection machine offers full inspection coverage and 3D measurement of all types of paste deposits down to 01005 and micro-BGA pads. Supports high-speed SMT lines, with a 3 FOV/sec. rate (FOV size is 30.72mm x 30.72mm). Automatic operations. Closed-loop feedback and user alert system. Connects to central database. Bidirectional light projection eliminates shadow effects. Calculates and compensates for PCB warpage. Insensitive to color. Resolution: 15 microns. Volume accuracy is <1% at 3 Sigma.

ALeader, www.aleader-europe.com