Supreme 3HTND-2DM rapid curing, toughened, one-part epoxy is for chip-on-board encapsulation using the dam-and-fill method.

Passes ASTM E595 specifications for NASA low outgassing. Bonds well to a variety of substrates used including silicon and other semiconductors, metals, ceramics and many plastics. Enhanced dimensional stability; tensile strength of 6,000-7,500 psi at room temperature. Maintains Shore D hardness of 85 after 1,000 hr. at 85°C/85% RH. Thermal conductivity of 10-11 BTU•in/ft²•hr•°F [1.44-1.59 W/(m•K)]. Withstands exposure to water and chemicals such as acids, bases, fuels and a number of common solvents. Low ionic levels of chlorine, sodium and potassium (less than 10ppm). Easy to handle and offers “unlimited” working life at room temperature. Cures readily at 250°F in 20-30 min. or 5-10 min. at 300°F. Serviceable from -100° to +400°F (-73° to +204°C). Comes in syringes, cartridges and jars.

Master Bond

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