XM Bond high-resolution camera is for inline wire bond inspection.

Includes 21 x 21mm field-of-view size and fine detail resolution. Is suited for precise inspection of thin wires in the production line. Applications include signal processing in the automotive and aerospace sectors. Offers resolution of 4.5µm per pixel. Telecentric lens ensures, regardless of the distance to an object, inspection window has the same image scale; prevents areas on the electronic assembly next to tall components from being hidden. A focus area optimally adjustable to the object height is ensured by an integrated z-axis with 20mm travel.

Viscom
www.viscom.com