OM-347 ultra-cleanable, no-clean, lead-free, zero-halogen solder paste material prints and reflows Type 4 and Type 5 powder.

Reflow process window delivers good soldering on Cu OSP with excellent coalescence on a broad range of deposit sizes and shows random solder ball and mid-chip solder ball resistance. Demonstrates print volume deposit repeatability, reducing defects from print process variability.

Alpha Assembly Solutions

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